Ultrasonic Consolidation (UC) uses an ultrasonic welding process to fuse layers of metal foil together. The slice date profile is then machined using a rotating cutter. This hybrid system uses additive and subtractive fabrication that can offer significant advantages over traditional manufacturing. Most notable are benefits from the ability to join dissimilar materials, providing functionally graded composite material characteristics, and the option of inserting enclosed components, such as sensors or electronic circuitry, into the part during the built process. UC is particularly suitable for this application as it is a cold joining process thus there is little risk of damage to electronic components due to overheating, as it the case in many other additive processes.

Currently there is a commercially available system produced by Solidica